Intel^® Xeon^® Scalable Platform design

RS700-E9-RS12 is built on the Intel^® Xeon^® Scalable Platform to deliver incredible 1U server performance, packing incredible power into minimal space. 24 DIMM slots provide best-in-class memory capacity and bandwidth, and an integrated I/O controller on the processor eliminates data transfer bottlenecks caused by discrete I/O chipsets for reduced latency and dramatically faster system performance.

User-friendly design for easier server maintenance

RS700-E9-RS12 features numerous user-friendly design features that simplify server maintenance. The server's Q-code is visible from the outside of the case to make diagnosing issues easier and more convenient. A tool-less rack rail kit is included for easy server installation and removal, and a tool-less, hot-swappable fan provides faster and simpler maintenance.

Advanced I/O support for 3+1 Expandability

RS700-E9-RS12 offers one full-high PCI Express 3.0 x16 slot (x16 link), one low-profile PCI Express 3.0 x16 slot (x8 link), one low-profile PCI Express 3.0 x8 slot (x8 link), and one OCP 2.0 Mezzanine slot (x16 link) to support 10G/25G/100G LAN card. The flexible expansions offer diverse applications in storage and networking to meeting the demands of future expansion and high scalability in a 1U server.

Smart thermal design for energy efficiency

RS700-E9-RS12 features a smart thermal radar design with more ambient thermal sensors for the CPU, memory, GPU, SSD, LAN card and front-panel board that provide improved temperature monitoring and enable dynamic fan speed adjustment for better power efficiency. This smart thermal design reduces fan power consumption by up to 20% and eliminates the power-sharing board for improved efficiency and lower operation costs.